Location

La Jolla, CA

Start Date

1-1-1998 12:00 AM

Description

The ultrasonic method is promising for the nondestructive characterization of imperfect interfaces in many joined structures (for example solid state bonds, adhesive joints, etc.) When the interphasial layer containing imperfections is thin and the imperfections are flat the interphasial layer can be modeled as an infinitely thin interface with distributed springs to account for interfacial stiffness reduction due to imperfections [1]. Significant effort has been put into experimental and theoretical studies of ultrasonic wave interaction with imperfect interfaces [1]–[15] with the goal of characterizing interface imperfections by the ultrasonic signature. It has been shown that by measuring the frequency response of the coefficient of reflection from an interface with spring boundary conditions one can determine the interfacial spring stiffness.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

17B

Chapter

Chapter 5: Engineered Materials

Section

Coatings, Films and Bond

Pages

1379-1386

DOI

10.1007/978-1-4615-5339-7_178

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Ultrasonic Spectroscopy of two Parallel Imperfect Interfaces

La Jolla, CA

The ultrasonic method is promising for the nondestructive characterization of imperfect interfaces in many joined structures (for example solid state bonds, adhesive joints, etc.) When the interphasial layer containing imperfections is thin and the imperfections are flat the interphasial layer can be modeled as an infinitely thin interface with distributed springs to account for interfacial stiffness reduction due to imperfections [1]. Significant effort has been put into experimental and theoretical studies of ultrasonic wave interaction with imperfect interfaces [1]–[15] with the goal of characterizing interface imperfections by the ultrasonic signature. It has been shown that by measuring the frequency response of the coefficient of reflection from an interface with spring boundary conditions one can determine the interfacial spring stiffness.