Location

La Jolla, CA

Start Date

1-1-1998 12:00 AM

Description

In recent years, Laser Speckle Pattern Interferometry(SPI) and its development have enabled surface deformation of structure components and materials to be accurately examined. SPI is a very useful method for measuring in-plane components of displacement. In measuring thermal expansion coefficient, the various problems are occurred, and the measuring limitation is existed. In this study, INCONEL 601 and Tantalum were used as specimen material. Specimens were heated to the high temperature(1000 °C) by electric current.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

17B

Chapter

Chapter 7: New Inspection/Control Procedures

Section

New Techniques

Pages

1801-1808

DOI

10.1007/978-1-4615-5339-7_233

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

A Study on the Measurement of in-Plane Displacement at High Temperature by Electronic Speckle Pattern Interferometry Method

La Jolla, CA

In recent years, Laser Speckle Pattern Interferometry(SPI) and its development have enabled surface deformation of structure components and materials to be accurately examined. SPI is a very useful method for measuring in-plane components of displacement. In measuring thermal expansion coefficient, the various problems are occurred, and the measuring limitation is existed. In this study, INCONEL 601 and Tantalum were used as specimen material. Specimens were heated to the high temperature(1000 °C) by electric current.