Inspection of Flip-Chip Epoxy Underfill in Microelectronic Assemblies Using Compensated Laser-Based Ultrasonic Receivers

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1998
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Pepper, D.
Dunning, G.
Chiao, M. P.
O'Meara, T.
Mitchell, P.
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Review of Progress in Quantitative Nondestructive Evaluation
Center for Nondestructive Evaluation

Begun in 1973, the Review of Progress in Quantitative Nondestructive Evaluation (QNDE) is the premier international NDE meeting designed to provide an interface between research and early engineering through the presentation of current ideas and results focused on facilitating a rapid transfer to engineering development.

This site provides free, public access to papers presented at the annual QNDE conference between 1983 and 1999, and abstracts for papers presented at the conference since 2001.

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In the industrial community, there is a need for process control and inspection tools that can improve the efficiency, yield and performance of various manufacturing processes including bonds, surface treatments, case hardening, composites, metallurgy, microcrack detection, adhesion, remote temperature and thickness measurements. By performing the inspection on-line and in real-time, the possibility exists for closed-loop, in-process control. This can lead to reducing cost, labor, scrap, and machine downtime. Conventional ultrasonic methods can be employed to diagnose many materials, in that their acoustic properties are typically functions of the parameters to be ascertained. Present techniques, such as liquid immersion, jet-spray approaches, air-coupled and direct transducer contacting may be of limited use in many process-control applications, including those involving vacuums, high temperatures, plasmas, and workpieces with highly structured and complex surfaces.

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Thu Jan 01 00:00:00 UTC 1998