Location

Snowbird, UT, USA

Start Date

1-1-1999 12:00 AM

Description

One of the most elusive yet critical problem in adhesive joints characterization is that of ‘kissing bond’ wherein good contact exists among the adherend and the adhesive, however with no acceptable levels of adhesion. To date, the kissing bond is difficult to be detected reliably by any of the methods including conventional ultrasound and thermal waves. Kissing bond which is a manufacturing defect/anomaly will substantially compromise the load bearing capability of the adhesive joint by initiating adhesive failure (in contrast to cohesive failure wherein the failure occurs within the thickness of the adhesive layer instead of a failure at the interface). Attempts to develop methods of detection of kissing bonds have been unsuccessful to date.

Book Title

Review of Progress in Quantitative Nondestructive Evaluation

Volume

18B

Chapter

Chapter 5: Engineered Materials

Section

Coatings, Interfaces, and Bonds

Pages

1533-1542

DOI

10.1007/978-1-4615-4791-4_197

Language

en

File Format

application/pdf

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Jan 1st, 12:00 AM

Adhesive Joint Evaluation Using Lamb Wave Modes with Appropriate Displacement, Stress, and Energy Distribution Profiles

Snowbird, UT, USA

One of the most elusive yet critical problem in adhesive joints characterization is that of ‘kissing bond’ wherein good contact exists among the adherend and the adhesive, however with no acceptable levels of adhesion. To date, the kissing bond is difficult to be detected reliably by any of the methods including conventional ultrasound and thermal waves. Kissing bond which is a manufacturing defect/anomaly will substantially compromise the load bearing capability of the adhesive joint by initiating adhesive failure (in contrast to cohesive failure wherein the failure occurs within the thickness of the adhesive layer instead of a failure at the interface). Attempts to develop methods of detection of kissing bonds have been unsuccessful to date.