Degree Type

Thesis

Date of Award

2008

Degree Name

Master of Science

Department

Mechanical Engineering

First Advisor

Pranav Shrotriya

Second Advisor

Abhijit Chandra

Third Advisor

Andrew Hillier

Abstract

An experiment setup was used to investigate the effects of contact loads, surface stress state and surface environment on dissolution and damage of copper surface. A range of surface stress state was generated with a four-point-bending setup on a well-polished copper sample. Single asperity contact was investigated using the cantilever tip of an Atomic Force Microscope. Controlled tip contact pressures were applied on the copper surface to mechanically stimulate the stressed surface. The experiment was performed in different environments to determine the chemical effects. Volume of material removed during the process was measured to determine material removal rate as a function of contact pressure, surface stress state and environments. It shows, as expected, higher contact pressures accelerate the material removal rates but complicated behaviors of the effects of surface stress and environments were observed. Mechanics governing material removal and their removal to Chemical Mechanical Polishing of copper was discussed.

DOI

https://doi.org/10.31274/rtd-180813-16053

Publisher

Digital Repository @ Iowa State University, http://lib.dr.iastate.edu/

Copyright Owner

Bun Hiong Chua

Language

en

Proquest ID

AAI1450151

OCLC Number

229405408

ISBN

9780549422372

File Format

application/pdf

File Size

87 pages

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